Carbon Nanotubes for Chips of the Future

Intel Ireland researchers, as part of the CARBonCHIP consortium, are investigating the use of carbon nanotubes - long cylindrical carbon honeycomb sheets - for possible use in future chips. These materials have some unique properties such as very low resistance when bundled together in high densities and high current carrying capability, but their precise manufacturing and placement are notoriously difficult.

A key outcome of a recent 3 year project was the successful carbon nanotube growth and integration on silicon achieved in via holes (vertical interconnects in chips). The team also proved that the pores in zeolites integrated in trenches and vias on silicon could be filled with carbon nanotubes. This technique helps to confine and arrange small diameter carbon nanotubes on silicon to achieve the densities required for future interconnects.

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