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- Date:
- Monday , June 25, 2007
- Author:
- Morry Teitelman
- Editor:
- Kyle Bennett
- Google +1
GIGABYTE P35T-DQ6
GIGABYTE comes out of the gate swinging, with the latest addition to their much vaunted DQ6 motherboard line. The P35T-DQ6 boasts full support for the latest Intel technologies, including a 1333MHz CPU FSB and DDR3 memory, and seems to be GIGABYTE’s latest bid for the performance crown.
BIOS (continued)
The MB Intelligent Tweaker(M.I.T.) menu contains user configurable voltage and frequency settings for the board.
The Robust Graphics Booster option controls how aggressively the system accesses to the PCI Express x16 slot bus, with Turbo again being the most aggressive setting available. The CPU Clock Ratio option sets the base CPU multiplier, with the settings available determined by the current CPU in use. The CPU Host Frequency(Mhz) setting controls the base CPU FSB speed, with a maximum setting allowed of 700MHz. The actual speed of the CPU is calculated by multiplying the CPU Clock Ratio setting with the CPU Host Frequency(Mhz) setting. The PCI Express Frequency(Mhz) option sets the bus speed for all PCI Express devices, with a 150MHz maximum speed settable.
GIGABYTE chose to include an automated overclocking utility in with the BIOS, named C.I.A.2 (CPU Intelligent Accelerator 2). The C.I.A.2 option sets the response level of the BIOS controlled overclocking engine through the use of preset states: Cruise, Sports, Racing, Turbo, and Full Thrust. The Cruise mode is the least aggressive setting, while the Full Thrust mode offers the most aggressive automated overclock. The Performance Enhance setting controls chipset internal timing related access settings, with the Extreme option being the most aggressive setting available. The speed of the system memory modules is configured through the System Memory Multiplier (SPD) option through the use of numerous multipliers. Actual memory speed, based on the currently select memory ratio and CPU FSB, displays under the read-only Memory Frequency(MHz) setting. The High Speed DRAM DLL Settings option configures internal memory bus timing settings. The setting of this option becomes crucial when attempting memory based overclocking with the board.
With the DRAM Timing Selectable option to Manual, the user configurable memory timing settings become accessible. The timing options available for tuning include the following: cas latency; RAS to CAS delay; RAS precharge; active to precharge delay (Precharge delay(tRAS)); active cycle delay (ACT to ACT Delay(tRRD)); write to read delay; write to precharge delay; active refresh delay (Refresh to ACT Delay); read to precharge delay; row precharge delay (tRD); and row precharge phase adjustment (tRD Phase Adjustment) . Note that on the listed memory timings options, the numerically lower setting forces more aggressive memory operation.
The system voltage settings become user configurable with the System Voltage Control option set to Manual. The DDR3 OverVoltage option controls the power supplied to the system memory modules, with a maximum voltage addition of +1.55V allows. Note that when using a voltage addition of more than .2V, you should implement active cooling of the system memory modules. The PCI-E OverVoltage Control setting configures the PCI Express slot voltage, with a +0.35V settable. The FSB OverVoltage Control option sets the Northbridge chipset voltage, with a +0.35V maximum. The Southbridge voltage is configured through the (G)MCH OverVoltage Control setting, with a slightly higher +0.375V maximum allowed. The base CPU voltage is set using the CPU Voltage Control option, with a massive 2.050V setting allowed. Note that the CPU default voltage displays within the read-only Normal CPU Vcore setting.